DFA review is part of every NPI engagement. Key design principles that reduce cost and improve yield:
Component Selection
- Prefer standard package sizes: 0402, 0603, 0805 for passives (avoid 0201 unless density requires it)
- Select components with multiple qualified sources — single-source parts create supply chain risk
- Avoid obsolete or end-of-life components; cross-reference Octopart or SiliconExpert during design
- Standardize passive values across your BOM where possible (reduces component changeovers)
- For BGAs and QFPs, confirm pad design matches IPC-7351 land pattern recommendations
Thermal Design
- Place high-dissipation components (MOSFETs, drivers, LDOs) near board edges for thermal management
- Include thermal reliefs on PTH pads in power planes — prevents cold solder joints
- Define copper pours and thermal vias explicitly; do not rely on default EDA settings
Panelization
- Amtech will work with you to develop a panel the effectively produce your product in our manufacturing process.