Boards that can be tested efficiently save time and money in production. Designing for test is not optional for quality-critical programs.
- Include test points for all critical nets — minimum 1mm Square, 1.5mm pitch for ICT probes
- Place test points on the primary assembly side where possible
- Avoid placing test points under BGA devices
- Include a JTAG boundary scan header if microcontroller-intensive design
- Document all test point net names in your assembly drawing
- For functional test: provide connector pinouts and expected stimulus/response definitions